- Semiconductor
- Semiconductor processing
Semiconductor processing
The processing steps in semiconductor manufacturing are crucial to quality control. Doping, etching, deposition, lithography and metallisation all contribute to producing the intricacies of the final products. Between each of these layers, polishing ensures the wafer is prepared for the next step of the process.
Condition-based monitoring of critical equipment provides real-time data that leads to:
- Reduced scrap rates
- Increased machine availability
- Improved product quality
Alerting you to an impending machine failure reduces the risk of product defects and scrapped wafers. By implementing vibration monitoring via IO-Link, you can implement edge computing for immediate action during production. Using the Y-path of IO-Link, you can simultaneously send equipment data to on-premise software for trend analysis to develop predictive maintenance schedules.
Applications
CMP polisher
Discover how ifm’s sensor solutions optimise CMP processes by reducing downtimes, improving surface quality and ensuring slurry distribution.
Quartz tube furnace
Learn about the importance of predictive maintenance and continuous vibration monitoring to prevent downtimes and maintain wafer purity levels.
